On Shore Technology Inc. - BU200Z-178-HT

KEY Part #: K3360391

BU200Z-178-HT Pricing (USD) [29134pcs Stock]

  • 1 pcs$1.41465
  • 10 pcs$1.35824
  • 25 pcs$1.24489
  • 50 pcs$1.18830
  • 100 pcs$1.07368
  • 250 pcs$0.93947
  • 500 pcs$0.91263
  • 1,000 pcs$0.77842
  • 2,500 pcs$0.72473

Part Number:
BU200Z-178-HT
Manufacturer:
On Shore Technology Inc.
Detailed description:
CONN IC DIP SOCKET 20POS GOLD.
Manufacturer's standard lead time:
In stock
Shelf life:
One Year
Chip From:
Hong Kong
RoHS:
Payment method:
Shipment way:
Family Categories:
KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Keystone - Faceplates, Frames, Circular Connectors - Housings, D-Sub, D-Shaped Connectors - Backshells, Hoods, FFC, FPC (Flat Flexible) Connectors - Housings, Terminal Blocks - Wire to Board, Backplane Connectors - ARINC Inserts, Between Series Adapters and Terminals - Adapters ...
Competitive Advantage:
We specialize in On Shore Technology Inc. BU200Z-178-HT electronic components. BU200Z-178-HT can be shipped within 24 hours after order. If you have any demands for BU200Z-178-HT, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

BU200Z-178-HT Product Attributes

Part Number : BU200Z-178-HT
Manufacturer : On Shore Technology Inc.
Description : CONN IC DIP SOCKET 20POS GOLD
Series : BU-178HT
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 20 (2 x 10)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 78.7µin (2.00µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Surface Mount
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Copper
Contact Finish Thickness - Post : Flash
Contact Material - Post : Brass
Housing Material : Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature : -55°C ~ 125°C