On Shore Technology Inc. - BU060Z-178-HT

KEY Part #: K3362548

BU060Z-178-HT Pricing (USD) [83500pcs Stock]

  • 1 pcs$0.46827
  • 10 pcs$0.41057
  • 25 pcs$0.38632
  • 50 pcs$0.37027
  • 100 pcs$0.33499
  • 250 pcs$0.30454
  • 500 pcs$0.27408
  • 1,000 pcs$0.24363
  • 2,500 pcs$0.22079

Part Number:
BU060Z-178-HT
Manufacturer:
On Shore Technology Inc.
Detailed description:
CONN IC DIP SOCKET 6POS GOLD.
Manufacturer's standard lead time:
In stock
Shelf life:
One Year
Chip From:
Hong Kong
RoHS:
Payment method:
Shipment way:
Family Categories:
KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Photovoltaic (Solar Panel) Connectors - Accessories, Pluggable Connectors, Keystone - Faceplates, Frames, Rectangular Connectors - Accessories, Rectangular Connectors - Headers, Male Pins, Terminal Junction Systems, Barrel - Power Connectors and Barrel - Audio Adapters ...
Competitive Advantage:
We specialize in On Shore Technology Inc. BU060Z-178-HT electronic components. BU060Z-178-HT can be shipped within 24 hours after order. If you have any demands for BU060Z-178-HT, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

BU060Z-178-HT Product Attributes

Part Number : BU060Z-178-HT
Manufacturer : On Shore Technology Inc.
Description : CONN IC DIP SOCKET 6POS GOLD
Series : BU-178HT
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 6 (2 x 3)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 78.7µin (2.00µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Surface Mount
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Copper
Contact Finish Thickness - Post : Flash
Contact Material - Post : Brass
Housing Material : Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature : -55°C ~ 125°C