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PA0196 Product Attributes
Part Number :PA0196
Manufacturer :Chip Quik Inc.
Description :TSSOP-64-EXP-PAD TO DIP-64 SMT
Series :Proto-Advantage
Part Status :Active
Proto Board Type :SMD to DIP
Package Accepted :TSSOP
Number of Positions :64
Pitch :0.020" (0.50mm)
Board Thickness :0.062" (1.57mm) 1/16"
Material :FR4 Epoxy Glass
Size / Dimension :1.000" x 3.200" (25.40mm x 81.28mm)