Samsung Semiconductor - K4B2G1646F-BMMA

KEY Part #: K7359663

[21752pcs Stock]


    Part Number:
    K4B2G1646F-BMMA
    Manufacturer:
    Samsung Semiconductor
    Detailed description:
    2 Gb 128M x 16 1600 Mbps 1.35 V -40 ~ 95 °C 96FBGA Mass Production.
    Manufacturer's standard lead time:
    In stock
    Shelf life:
    One Year
    Chip From:
    Hong Kong
    RoHS:
    Payment method:
    Shipment way:
    Family Categories:
    KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : HBM Aquabolt, LPDDR5, DDR3, LPDDR3, SLC Nand, MODULE, DDR4 and GDDR6 ...
    Competitive Advantage:
    We specialize in Samsung Semiconductor K4B2G1646F-BMMA electronic components. K4B2G1646F-BMMA can be shipped within 24 hours after order. If you have any demands for K4B2G1646F-BMMA, Please submit a Request for Quotation here or send us an email:

    K4B2G1646F-BMMA Product Attributes

    Part Number : K4B2G1646F-BMMA
    Manufacturer : Samsung Semiconductor
    Description : 2 Gb 128M x 16 1600 Mbps 1.35 V -40 ~ 95 °C 96FBGA Mass Production
    Series : DDR3
    Density : 2 Gb
    Org. : 128M x 16
    Speed : 1600 Mbps
    Voltage : 1.35 V
    Temp. : -40 ~ 95 °C
    Package : 96FBGA

    You May Also Be Interested In
    • K3UH5H50AM-AGCL

      Samsung Semiconductor

      32 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 556FBGA Mass Production.

    • K3UH5H50AM-EGCL

      Samsung Semiconductor

      32 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 376FBGA Mass Production.

    • K3UH5H50AM-JGCL

      Samsung Semiconductor

      32 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 432FBGA Mass Production.

    • K3UH6H60BM-AGCL

      Samsung Semiconductor

      48 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 556FBGA Mass Production.

    • K3UH6H60BM-EGCL

      Samsung Semiconductor

      48 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 376FBGA Mass Production.

    • K3UH7H70AM-AGCL

      Samsung Semiconductor

      64 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 556FBGA Mass Production.