DILB8P-223TLF Pricing (USD) [467606pcs Stock]
- 1 pcs$0.07514
- 10 pcs$0.06921
- 25 pcs$0.05157
- 50 pcs$0.04430
- 100 pcs$0.04279
- 250 pcs$0.03688
- 500 pcs$0.03541
- 1,000 pcs$0.03098
- 2,500 pcs$0.02803
- Part Number:
- DILB8P-223TLF
- Manufacturer:
- Amphenol ICC (FCI)
- Detailed description:
- CONN IC DIP SOCKET 8POS TIN. IC & Component Sockets 8P IC SOCKET
- Manufacturer's standard lead time:
- In stock
- Shelf life:
- One Year
- Chip From:
- Hong Kong
- RoHS:
- Payment method:
-
- Shipment way:
- Family Categories:
- KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Coaxial Connectors (RF), Modular Connectors - Jacks, Terminal Junction Systems, Pluggable Connectors, Contacts - Leadframe, Terminals - PC Pin Receptacles, Socket Connectors, Card Edge Connectors - Housings and Terminal Blocks - Interface Modules ...
- Competitive Advantage:
- We specialize in Amphenol ICC (FCI) DILB8P-223TLF electronic components. DILB8P-223TLF can be shipped within 24 hours after order. If you have any demands for DILB8P-223TLF, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
DILB8P-223TLF Product Attributes
Part Number :
DILB8P-223TLF
Manufacturer :
Amphenol ICC (FCI)
Description :
CONN IC DIP SOCKET 8POS TIN
Series :
-
Part Status :
Active
Type :
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) :
8 (2 x 4)
Pitch - Mating :
0.100" (2.54mm)
Contact Finish - Mating :
Tin
Contact Finish Thickness - Mating :
100.0µin (2.54µm)
Contact Material - Mating :
Copper Alloy
Mounting Type :
Through Hole
Features :
Open Frame
Termination :
Solder
Pitch - Post :
0.100" (2.54mm)
Contact Finish - Post :
Tin
Contact Finish Thickness - Post :
100.0µin (2.54µm)
Contact Material - Post :
Copper Alloy
Housing Material :
Polyamide (PA), Nylon
Operating Temperature :
-55°C ~ 105°C
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