Manufacturer :
Wakefield-Vette
Description :
HEATSINK CPU 43MM SQ BLK H.65
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method :
Thermal Tape, Adhesive (Not Included)
Length :
1.750" (44.45mm)
Height Off Base (Height of Fin) :
0.650" (16.51mm)
Power Dissipation @ Temperature Rise :
3.0W @ 20°C
Thermal Resistance @ Forced Air Flow :
2.00°C/W @ 400 LFM
Thermal Resistance @ Natural :
-
Material Finish :
Black Anodized