Omron Electronics Inc-EMC Div - XR2D-4001-N

KEY Part #: K3350313

[6808pcs Stock]


    Part Number:
    XR2D-4001-N
    Manufacturer:
    Omron Electronics Inc-EMC Div
    Detailed description:
    CONN IC DIP SOCKET 40POS GOLD.
    Manufacturer's standard lead time:
    In stock
    Shelf life:
    One Year
    Chip From:
    Hong Kong
    RoHS:
    Payment method:
    Shipment way:
    Family Categories:
    KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Terminal Blocks - Barrier Blocks, Sockets for ICs, Transistors - Accessories, Modular Connectors - Plugs, Barrel - Power Connectors, D-Sub, D-Shaped Connectors - Accessories, Terminal Junction Systems, LGH Connectors and Coaxial Connectors (RF) - Contacts ...
    Competitive Advantage:
    We specialize in Omron Electronics Inc-EMC Div XR2D-4001-N electronic components. XR2D-4001-N can be shipped within 24 hours after order. If you have any demands for XR2D-4001-N, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    XR2D-4001-N Product Attributes

    Part Number : XR2D-4001-N
    Manufacturer : Omron Electronics Inc-EMC Div
    Description : CONN IC DIP SOCKET 40POS GOLD
    Series : XR2
    Part Status : Obsolete
    Type : DIP, 0.6" (15.24mm) Row Spacing
    Number of Positions or Pins (Grid) : 40 (2 x 20)
    Pitch - Mating : 0.100" (2.54mm)
    Contact Finish - Mating : Gold
    Contact Finish Thickness - Mating : 29.5µin (0.75µm)
    Contact Material - Mating : Beryllium Copper
    Mounting Type : Through Hole
    Features : Carrier
    Termination : Solder
    Pitch - Post : 0.100" (2.54mm)
    Contact Finish - Post : Gold
    Contact Finish Thickness - Post : 29.5µin (0.75µm)
    Contact Material - Post : Beryllium Copper
    Housing Material : Polybutylene Terephthalate (PBT), Glass Filled
    Operating Temperature : -55°C ~ 125°C

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