Amphenol ICC (FCI) - DILB32P-223TLF

KEY Part #: K3363285

DILB32P-223TLF Pricing (USD) [194835pcs Stock]

  • 1 pcs$0.18984
  • 10,800 pcs$0.07555

Part Number:
DILB32P-223TLF
Manufacturer:
Amphenol ICC (FCI)
Detailed description:
CONN IC DIP SOCKET 32POS TINLEAD. IC & Component Sockets SOCKETS DIP
Manufacturer's standard lead time:
In stock
Shelf life:
One Year
Chip From:
Hong Kong
RoHS:
Payment method:
Shipment way:
Family Categories:
KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Card Edge Connectors - Housings, Rectangular Connectors - Free Hanging, Panel Mount, Barrel - Accessories, Coaxial Connectors (RF) - Contacts, Terminals - Specialized Connectors, Solid State Lighting Connectors - Contacts, Between Series Adapters and Card Edge Connectors - Edgeboard Connectors ...
Competitive Advantage:
We specialize in Amphenol ICC (FCI) DILB32P-223TLF electronic components. DILB32P-223TLF can be shipped within 24 hours after order. If you have any demands for DILB32P-223TLF, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

DILB32P-223TLF Product Attributes

Part Number : DILB32P-223TLF
Manufacturer : Amphenol ICC (FCI)
Description : CONN IC DIP SOCKET 32POS TINLEAD
Series : DILB
Part Status : Active
Type : DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) : 32 (2 x 16)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin-Lead
Contact Finish Thickness - Mating : 100.0µin (2.54µm)
Contact Material - Mating : Copper Alloy
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Contact Finish Thickness - Post : 100.0µin (2.54µm)
Contact Material - Post : Copper Alloy
Housing Material : Polyamide (PA), Nylon
Operating Temperature : -55°C ~ 125°C