Aries Electronics - 24-3575-18

KEY Part #: K3342906

24-3575-18 Pricing (USD) [1273pcs Stock]

  • 1 pcs$34.15716
  • 10 pcs$33.98722

Part Number:
24-3575-18
Manufacturer:
Aries Electronics
Detailed description:
CONN IC DIP SOCKET ZIF 24POS TIN. IC & Component Sockets QUICK RELEASE 24 PIN HI TEMP
Manufacturer's standard lead time:
In stock
Shelf life:
One Year
Chip From:
Hong Kong
RoHS:
Payment method:
Shipment way:
Family Categories:
KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Backplane Connectors - ARINC, Card Edge Connectors - Contacts, Rectangular Connectors - Board In, Direct Wire to Board, Keystone - Accessories, Terminal Blocks - Din Rail, Channel, Fiber Optic Connectors - Housings, Terminal Blocks - Contacts and Rectangular Connectors - Accessories ...
Competitive Advantage:
We specialize in Aries Electronics 24-3575-18 electronic components. 24-3575-18 can be shipped within 24 hours after order. If you have any demands for 24-3575-18, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

24-3575-18 Product Attributes

Part Number : 24-3575-18
Manufacturer : Aries Electronics
Description : CONN IC DIP SOCKET ZIF 24POS TIN
Series : 57
Part Status : Active
Type : DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 24 (2 x 12)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 200.0µin (5.08µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Beryllium Copper
Housing Material : Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature : -
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