Infineon Technologies - BGM13GBA9E6327XTSA1

KEY Part #: K7122115

BGM13GBA9E6327XTSA1 Pricing (USD) [289306pcs Stock]

  • 1 pcs$0.12849
  • 4,500 pcs$0.12785

Part Number:
BGM13GBA9E6327XTSA1
Manufacturer:
Infineon Technologies
Detailed description:
MULTI CHIP MODULES.
Manufacturer's standard lead time:
In stock
Shelf life:
One Year
Chip From:
Hong Kong
RoHS:
Payment method:
Shipment way:
Family Categories:
KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : RF Misc ICs and Modules, RF Transmitters, RFID Transponders, Tags, RFID, RF Access, Monitoring ICs, RF Amplifiers, RF Transceiver Modules, RFID Accessories and Attenuators ...
Competitive Advantage:
We specialize in Infineon Technologies BGM13GBA9E6327XTSA1 electronic components. BGM13GBA9E6327XTSA1 can be shipped within 24 hours after order. If you have any demands for BGM13GBA9E6327XTSA1, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

BGM13GBA9E6327XTSA1 Product Attributes

Part Number : BGM13GBA9E6327XTSA1
Manufacturer : Infineon Technologies
Description : MULTI CHIP MODULES
Series : -
Part Status : Active
RF Family/Standard : Bluetooth
Protocol : 802.11a/b/g/n, Bluetooth v4.0
Modulation : 16QAM, 64QAM, 256QAM, DSSS, FHSS, OFDM
Frequency : 1.452GHz ~ 1.61GHz
Data Rate : 54Mbps
Power - Output : -
Sensitivity : -
Serial Interfaces : SPI, USB
Antenna Type : -
Utilized IC / Part : -
Memory Size : -
Voltage - Supply : 1.6V ~ 3.1V
Current - Receiving : -
Current - Transmitting : -
Mounting Type : Surface Mount
Operating Temperature : -40°C ~ 85°C
Package / Case : -

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