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  5. HF115AC-0.0055-AC-105

Bergquist - HF115AC-0.0055-AC-105

KEY Part #: K6149312

HF115AC-0.0055-AC-105 Pricing (USD) [1781360pcs Stock]

  • 1 pcs$0.02170
  • 6,000 pcs$0.02159
Part Number:
HF115AC-0.0055-AC-105
Manufacturer:
Bergquist
Detailed description:
THERM PAD 36.83MMX21.29MM W/ADH.
Manufacturer's standard lead time:
In stock
Shelf life:
One Year
Chip From:
Hong Kong
RoHS:
Payment method:
Shipment way:
Family Categories:
KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Thermal - Adhesives, Epoxies, Greases, Pastes, Thermal - Liquid Cooling, Fans - Accessories, Fans - Accessories - Fan Cords, Fans - Finger Guards, Filters & Sleeves, Thermal - Thermoelectric, Peltier Modules, Thermal - Heat Pipes, Vapor Chambers and Thermal - Heat Sinks ...
Competitive Advantage:
We specialize in Bergquist HF115AC-0.0055-AC-105 electronic components. HF115AC-0.0055-AC-105 can be shipped within 24 hours after order. If you have any demands for HF115AC-0.0055-AC-105, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

HF115AC-0.0055-AC-105 Product Attributes

Part Number : HF115AC-0.0055-AC-105
Manufacturer : Bergquist
Description : THERM PAD 36.83MMX21.29MM W/ADH
Series : Hi-Flow® 115-AC
Part Status : Active
Usage : SIP
Type : Pad, Sheet
Shape : Rectangular
Outline : 36.83mm x 21.29mm
Thickness : 0.0055" (0.140mm)
Material : Phase Change Compound
Adhesive : Adhesive - One Side
Backing, Carrier : Fiberglass
Color : Gray
Thermal Resistivity : 0.35°C/W
Thermal Conductivity : 0.8 W/m-K

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