[13694pcs Stock]
- Part Number:
- DIP050-628-157BLF
- Manufacturer:
- Amphenol ICC (FCI)
- Detailed description:
- CONN IC DIP SOCKET 28POS TIN.
- Manufacturer's standard lead time:
- In stock
- Shelf life:
- One Year
- Chip From:
- Hong Kong
- RoHS:
- Payment method:
-
- Shipment way:
- Family Categories:
- KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Solid State Lighting Connectors - Accessories, D-Shaped Connectors - Centronics, Card Edge Connectors - Edgeboard Connectors, D-Sub, D-Shaped Connectors - Adapters, Terminal Blocks - Accessories - Wire Ferrules, Heavy Duty Connectors - Inserts, Modules, Backplane Connectors - Housings and FFC, FPC (Flat Flexible) Connectors - Housings ...
- Competitive Advantage:
- We specialize in Amphenol ICC (FCI) DIP050-628-157BLF electronic components. DIP050-628-157BLF can be shipped within 24 hours after order. If you have any demands for DIP050-628-157BLF, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
DIP050-628-157BLF Product Attributes
Part Number :
DIP050-628-157BLF
Manufacturer :
Amphenol ICC (FCI)
Description :
CONN IC DIP SOCKET 28POS TIN
Series :
-
Part Status :
Obsolete
Type :
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) :
28 (2 x 14)
Pitch - Mating :
0.100" (2.54mm)
Contact Finish - Mating :
Tin
Contact Finish Thickness - Mating :
100.0µin (2.54µm)
Contact Material - Mating :
Beryllium Copper
Mounting Type :
Through Hole
Features :
Open Frame
Termination :
Solder
Pitch - Post :
0.100" (2.54mm)
Contact Finish - Post :
Tin
Contact Finish Thickness - Post :
200.0µin (5.08µm)
Contact Material - Post :
Brass
Housing Material :
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature :
-
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