GPHC3.0-0.080-02-0816 Pricing (USD) [849pcs Stock]
- 1 pcs$54.96296
- 4 pcs$54.68951
- Part Number:
- GPHC3.0-0.080-02-0816
- Manufacturer:
- Bergquist
- Detailed description:
- THERM PAD 406.4MMX203.2MM BLUE. Thermal Interface Products BERGQUIST GAP PAD TGP HC3000
- Manufacturer's standard lead time:
- In stock
- Shelf life:
- One Year
- Chip From:
- Hong Kong
- RoHS:
- Payment method:
-
- Shipment way:
- Family Categories:
- KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Fans - Finger Guards, Filters & Sleeves, Thermal - Accessories, AC Fans, Thermal - Heat Sinks, Fans - Accessories - Fan Cords, Thermal - Thermoelectric, Peltier Assemblies, Thermal - Liquid Cooling and Thermal - Heat Pipes, Vapor Chambers ...
- Competitive Advantage:
- We specialize in Bergquist GPHC3.0-0.080-02-0816 electronic components. GPHC3.0-0.080-02-0816 can be shipped within 24 hours after order. If you have any demands for GPHC3.0-0.080-02-0816, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
GPHC3.0-0.080-02-0816 Product Attributes
Part Number :
GPHC3.0-0.080-02-0816
Manufacturer :
Bergquist
Description :
THERM PAD 406.4MMX203.2MM BLUE
Series :
Gap Pad® HC 3.0
Part Status :
Active
Usage :
-
Type :
Pad, Sheet
Shape :
Rectangular
Outline :
406.40mm x 203.20mm
Thickness :
0.0800" (2.032mm)
Material :
-
Adhesive :
Tacky - Both Sides
Backing, Carrier :
Fiberglass
Color :
Blue
Thermal Resistivity :
-
Thermal Conductivity :
3.0 W/m-K
You May Also Be Interested In
-
PL-2-1-254
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-C-20
Wakefield-Vette
THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
Hot Parts
- A14562-02
- A14558-02
- A14950-20
- GPHC3.0-0.100-02-0816
- A14950-12
- A14950-07
- DC0011/09-PC99-0.06
- 5595S-20
- A16044-01
- DC0040/03-PC99-0.06
- DC0040/06-PC99-0.06
- DC0040/04-PC99-0.06
- DC0038/06-PC99-0.06
- TG4040S-320-320-1.0-0
- TG2030S-150-150-5.0-0
- TG2030S-100-100-3.0-0
- DC0019/03-PC99-0.06
- DC0022/02-PC99-0.06
- DC0025/01-PC99-0.06
- PC93-25-25-0.25
- PC93-5-5-0.25
- PC93-320-320-0.25-0
- GPVOU-0.020-01-0816
- A16365-17
- A16365-15
- A16364-08
- A15641-20
- A10195-06
- A14162-06
- SPK10-0.006-AC-1212
- 5595 210 MM X 300 MM 1.0 MM
- EYG-C121810C
- CPU .005" 12" X 12"
- DC0040/04-PC99AL-0.1
- TP01-M
- 71-10777
- SP400-0.007-AC-136
- PPK10-0.006-00-102
- SP1000-0.009-AC-43
- Q3-0.005-00-34