On Shore Technology Inc. - BU180Z-178-HT

KEY Part #: K3361000

BU180Z-178-HT Pricing (USD) [36819pcs Stock]

  • 1 pcs$1.06197
  • 10 pcs$0.96497
  • 25 pcs$0.90594
  • 50 pcs$0.86647
  • 100 pcs$0.82709
  • 250 pcs$0.74832
  • 500 pcs$0.68924
  • 1,000 pcs$0.59078
  • 2,500 pcs$0.55139

Part Number:
BU180Z-178-HT
Manufacturer:
On Shore Technology Inc.
Detailed description:
CONN IC DIP SOCKET 18POS GOLD.
Manufacturer's standard lead time:
In stock
Shelf life:
One Year
Chip From:
Hong Kong
RoHS:
Payment method:
Shipment way:
Family Categories:
KEY Components Co.,LTD is a Electronic Components Distributor who offers product categories including : Backplane Connectors - ARINC, Sockets for ICs, Transistors - Adapters, Backplane Connectors - Housings, Card Edge Connectors - Housings, Backplane Connectors - DIN 41612, Rectangular Connectors - Headers, Specialty Pin, Modular Connectors - Jacks and Terminal Strips and Turret Boards ...
Competitive Advantage:
We specialize in On Shore Technology Inc. BU180Z-178-HT electronic components. BU180Z-178-HT can be shipped within 24 hours after order. If you have any demands for BU180Z-178-HT, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

BU180Z-178-HT Product Attributes

Part Number : BU180Z-178-HT
Manufacturer : On Shore Technology Inc.
Description : CONN IC DIP SOCKET 18POS GOLD
Series : BU-178HT
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 18 (2 x 9)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 78.7µin (2.00µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Surface Mount
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Copper
Contact Finish Thickness - Post : Flash
Contact Material - Post : Brass
Housing Material : Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature : -55°C ~ 125°C