Part Number :
BDN16-3CB/A01
Manufacturer :
CTS Thermal Management Products
Description :
HEATSINK CPU W/ADHESIVE 1.61SQ
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method :
Thermal Tape, Adhesive (Included)
Length :
1.610" (40.89mm)
Height Off Base (Height of Fin) :
0.355" (9.02mm)
Power Dissipation @ Temperature Rise :
-
Thermal Resistance @ Forced Air Flow :
4.50°C/W @ 400 LFM
Thermal Resistance @ Natural :
13.50°C/W
Material Finish :
Black Anodized